Course | Postgraduate |
Semester | Electives |
Subject Code | AVR863 |
Subject Title | RF Packaging and Electromagnetic Compatibility |
EMC Requirements for Electronic Systems: Sources of EMI; Aspects of EMC; Radiated susceptibility; Conducted susceptibility; Electrostatic discharge; Design constraints for products; Advantages of EMC design; Transmission line per-unit-length parameters: Wire type structures, PCB structures; High-speed digital interconnects and signal integrity. Non-ideal Behavior of Components: Spurious effects of wires, PCB, component leads, resistors, capacitors, inductors, ferromagnetic materials, electromagnetic devices, MMIC components, digital circuit devices, and mechanical switches. Conducted and Radiated Emissions: Measurement of conducted emissions; Power supply filters; Power supply and its placement; Conducted susceptibility; Simple emission models for wires and PCB leads; Simple radiated susceptibility models for wires and PCB leads. Crosstalk: Three-conductor transmission lines, shielded wires, twisted wires, shielding. System Design for EMC: Safety ground; PCB design; System configuration and design.
Same as Reference
1. Introduction to Electromagnetic Compatibility, Paul, C.R., Wiley Interscience, 2006.
2. Electromagnetic Compatibility Handbook, Kaiser, K.L., CRC Press.
3. Engineering Electromagnetic Compatibility: Principles, Measurement and Technologies, Kodali, V.P., IEEE Press.
CO1: Analyze the different types of EMC standards and their requirements.
CO2: Design EMC compliant circuits for PCBs and the analysis of nonideal behaviour of various circuit elements.
CO3: Measurement of Conducted Emission, Radiated Emission, Conducted Immunity and Radiated Immunity in a test setup.
CO4: Analyze the methods of grounding and cabling.
CO5: Understand the PCB system design and configuration